Taiwan Semiconductor Manufacturing Company Limited (2330.TW)
| Previous close | 804.00 |
| Open | 796.00 |
| Bid | 804.00 x 0 |
| Ask | 805.00 x 0 |
| Day's range | 792.00 - 810.00 |
| 52-week range | 489.00 - 826.00 |
| Volume | |
| Avg. volume | 44,531,419 |
| Market cap | 20.852T |
| Beta (5Y monthly) | 1.24 |
| PE ratio (TTM) | 24.88 |
| EPS (TTM) | N/A |
| Earnings date | N/A |
| Forward dividend & yield | 14.00 (1.78%) |
| Ex-dividend date | 13 Jun 2024 |
| 1y target est | N/A |
- Business Wire
TSMC Announces Breakthrough Set to Redefine the Future of 3D IC
SANTA CLARA, Calif., September 27, 2023--TSMC (TSE: 2330, NYSE: TSM) today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform® (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D
- Business Wire
TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
HSINCHU, Taiwan & STUTTGART, Germany & MUNICH & EINDHOVEN, Netherlands, August 08, 2023--TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300mm fab to support the future
- Business Wire
TSMC Showcases New Technology Developments at 2023 Technology Symposium
SANTA CLARA, Calif., April 26, 2023--TSMC (TWSE: 2330, NYSE: TSM) today showcased its latest technology developments at its 2023 North America Technology Symposium, including progress in 2nm technology and new members of its industry-leading 3nm technology family, offering a range of processes tuned to meet diverse customer demands. These include N3P, an enhanced 3nm process for better power, performance and density, N3X, a process tailored for high performance computing (HPC) applications, and
