Based at CEA-Leti, Collaboration Focuses on Materials Engineering Solutions to Accelerate Semiconductor Device Development for Applied’s ICAPS Customers Applied Materials' Endura® Wafer Processing System The joint lab features several of Applied Materials’ 200mm and 300mm wafer processing systems, such as this Endura® system, and leverages CEA-Leti’s world-class capabilities for evaluating performance of new materials and device validation. SANTA CLARA, Calif. and GRENOBLE, France, Dec. 05, 2023
The validation marks a significant step towards Applied’s Net Zero 2040 Playbook – a collaborative approach to reducing the semiconductor industry’s carbon emissionsSANTA CLARA, Calif., Dec. 01, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced that its science-based Scope 1, 2 and 3 emissions reduction targets have received validation from the Science Based Targets initiative (SBTi). By setting a 1.5°C-aligned target, currently the most ambitious designation available through the
Applied Materials is rock solid, but a new semiconductor industry downturn could cause some bumps early in 2024.