Reuters
A group of Chinese chip companies led by Huawei Technologies and backed by the country's government aims to produce high-bandwidth memory (HBM) semiconductors, a key component in AI chips by 2026, The Information reported on Thursday. The project, part of China's efforts to provide home-grown alternatives to Nvidia's AI chips, started last year and includes Fujian Jinhua Integrated Circuit, a memory chip maker under U.S. sanctions along with Huawei, according to the report. The group also relies on other Chinese chip producers and packaging technology developers and it will work to tailor its memory chips to Huawei-designed AI processor chips and supporting motherboard components, the report said.