Grifols, S.A. (GIFLF)
| Previous close | 8.46 |
| Open | 9.12 |
| Bid | 0.00 x 0 |
| Ask | 0.00 x 0 |
| Day's range | 8.46 - 8.46 |
| 52-week range | 7.46 - 15.80 |
| Volume | |
| Avg. volume | 2,019 |
| Market cap | 5.439B |
| Beta (5Y monthly) | 0.68 |
| PE ratio (TTM) | 84.60 |
| EPS (TTM) | N/A |
| Earnings date | N/A |
| Forward dividend & yield | N/A (N/A) |
| Ex-dividend date | 03 Jun 2021 |
| 1y target est | N/A |
- Reuters
Spanish drug maker Grifols will bring in independent directors, chairman tells newspaper
MADRID (Reuters) -Spanish drug maker Grifols, battling a plunge in its share price this year, plans to add independent directors to its audit and compensation committees to improve its governance, its chairman said in a newspaper interview published on Sunday. Grifols' market value has shed billions of euros since short-sheller Gotham City Research released three reports in early January accusing the company of overstating earnings and understating debt. Grifols has repeatedly denied the claims.
- Bloomberg
Grifols Plans First Bond Sale Since Short Seller Attack
(Bloomberg) -- Grifols SA is seeking to issue a new bond, in what would be its first debt deal since coming under attack from a short seller in January.Most Read from BloombergUS Slams Strikes on Russia Oil Refineries as Risk to Oil MarketsUS Core CPI Tops Forecasts Again, Likely Delaying Fed Rate CutsChinese Cement Maker Halted After 99% Crash in 15 MinutesBond Trader Places Record Futures Bet on Eve of Inflation DataApple’s India iPhone Output Hits $14 Billion in China ShiftThe Barcelona-based
- Reuters
UPDATE 2-Europe's STOXX 600 logs weekly gains, US jobs data in focus
Europe's main stock indices were flat on Friday, but notched strong gains over the week that saw record highs from German and French shares, while investors also analysed a U.S. jobs report for clues on the global monetary policy outlook. Technology lost 1.6% after BE Semiconductor slumped 16.1% on a media report that Joint Electron Device Engineering Council lowered certain chip standards which might delay investments into hybrid bonding technology.
